Name: Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Brand: Wenyi Electronics
SKU: GPI-Flex-C-010
Price: 1.00 USD
Availability: InStock
Rating: 4.6 (153 reviews)

WenYI Electronics Electronics Co.,Ltd

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Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Product Details:

Place of Origin:	Made In China
Brand Name:	Wenyi Electronics
Certification:	RoHs,SGS，ISO9001:2008
Model Number:	GPI-Flex-C-010

Payment & Shipping Terms:

Minimum Order Quantity:	500 pcs/ lot
Price:	Negotiable
Packaging Details:	each in ploybag, then in carton box, or as per request.
Delivery Time:	12-15 working days afer sample approval
Payment Terms:	T/T, L/C, D/A, D/P, Western Union, MoneyGram
Supply Ability:	20000 square meters/ month

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Detailed Product Description

Material:	1 OZ Copper	Layer:	1-8 Layers
Print:	Silkscreen	Finger:	Sink Gold Or Tin Plated
Type:	LGF Backlight Module	Application:	Mobile Smart Device Backlight
High Light:	rigid flex circuits , all flex flexible circuits

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Item decription:

Mobile Smart Device Backlight LGF Module FPC Flexible Printed Circuit

Material: Polymide, LGF

Cover film: PI cover film

Type: LGF backlight module ( LED backlight )

Copper : 0.5 OZ

Finger Pitch: 1 mm gold finger

Stiffener: PI

Thickness: 0.27mm -0.36mm.

Business Terms:

MOQ : 500 pcs/ lot

Sample lead time: 8-12 working days

Mass production lead time: 10-14 working days , as per order Qty.

Payment By T/T or LC or others.

Our Advantage:

Strong R&D capability
Stable in quality
Experienced in backligth LGF module
Quick delivery
Capable to make 1-8 layers FPC
perfect quality control process.

Application:

* Household appliances
* Security systems, Bank POS machine payment service system.
* High Precision PCB and High Density PCB
* Various Mobile Smart Device use
* Various Mobile device FPC and Circuit module

Technical specification:

FPC Manufacturing Capability	Technical Performance Data
Finished FPC Size	Min.:4x4mm Max.:250x1200mm
FPC Board Thickness:	0.08-0.12mm for single layer, 0.12-0.22mm for double layer
Stiffener Material Choice	PI.PET,FR4-PI
Pitch of the Pin	0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm
Finished Board Thickness Tolerance	±0.03mm
Finished hole diameter(Min.)	0.15mm
Finished hole diameter(Max)	0.6mm
NPTH Hole diameter tolerance	±0.025mm
PTH hole diameter tolerance	±0.050mm
Copper foil thickness	18um,35um,70um/
Circuit width/spacing(Min.)	≥0.065mm(1/2oz)≥0.05mm(1/3oz)
Surface Finished type	OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc
Gold Flash Ni/Au thickness	Ni:2.54-9um Au:0.025-0.5um
Immersion Tin thickness	0.7-1.2um
Tin plating thickness	3-15um
Drill hole position tolerance	±0.05mm
Punching dimension tolerance	±0.05mm
Certificate	ROHS,UL,ISO9001 SGS, etc