WenYI Electronics Electronics Co.,Ltd
Customer's satifying is our gold medal, Win-Win cooperation in business is the real business.
WenYI Electronics Electronics Co.,Ltd
Customer's satifying is our gold medal, Win-Win cooperation in business is the real business.
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| Place of Origin: | Made In China |
| Brand Name: | Wenyi Electronics |
| Certification: | RoHs,SGS，ISO9001:2008 |
| Model Number: | GPI-Flex-C-010 |
| Minimum Order Quantity: | 500 pcs/ lot |
|---|---|
| Price: | Negotiable |
| Packaging Details: | each in ploybag, then in carton box, or as per request. |
| Delivery Time: | 12-15 working days afer sample approval |
| Payment Terms: | T/T, L/C, D/A, D/P, Western Union, MoneyGram |
| Supply Ability: | 20000 square meters/ month |
| Material: | 1 OZ Copper | Layer: | 1-8 Layers |
|---|---|---|---|
| Print: | Silkscreen | Finger: | Sink Gold Or Tin Plated |
| Type: | LGF Backlight Module | Application: | Mobile Smart Device Backlight |
| Highlight: | rigid flex circuits,all flex flexible circuits |
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Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Item decription:
Mobile Smart Device Backlight LGF Module FPC Flexible Printed Circuit
Material: Polymide, LGF
Cover film: PI cover film
Type: LGF backlight module ( LED backlight )
Copper : 0.5 OZ
Finger Pitch: 1 mm gold finger
Stiffener: PI
Thickness: 0.27mm -0.36mm.
Business Terms:
MOQ : 500 pcs/ lot
Sample lead time: 8-12 working days
Mass production lead time: 10-14 working days , as per order Qty.
Payment By T/T or LC or others.
Our Advantage:
Application:
Technical specification:
| FPC Manufacturing Capability | Technical Performance Data |
| Finished FPC Size | Min.:4x4mm Max.:250x1200mm |
| FPC Board Thickness: | 0.08-0.12mm for single layer, 0.12-0.22mm for double layer |
| Stiffener Material Choice | PI.PET,FR4-PI |
| Pitch of the Pin | 0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm |
| Finished Board Thickness Tolerance | ±0.03mm |
| Finished hole diameter(Min.) | 0.15mm |
| Finished hole diameter(Max) | 0.6mm |
| NPTH Hole diameter tolerance | ±0.025mm |
| PTH hole diameter tolerance | ±0.050mm |
| Copper foil thickness | 18um,35um,70um/ |
| Circuit width/spacing(Min.) | ≥0.065mm(1/2oz)≥0.05mm(1/3oz) |
| Surface Finished type | OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc |
| Gold Flash Ni/Au thickness | Ni:2.54-9um Au:0.025-0.5um |
| Immersion Tin thickness | 0.7-1.2um |
| Tin plating thickness | 3-15um |
| Drill hole position tolerance | ±0.05mm |
| Punching dimension tolerance | ±0.05mm |
| Certificate | ROHS,UL,ISO9001 SGS, etc |
Contact Person: Mr. Johnson
Tel: 86 13649868005
Fax: 86-769-87925876
